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LTC2299 Dual 14-Bit, 80Msps Low Power 3V ADC
FEATURES

DESCRIPTIO
Integrated Dual 14-Bit ADCs Sample Rate: 80Msps Single 3V Supply (2.7V to 3.4V) Low Power: 444mW 73dB SNR at 70MHz Input 90dB SFDR at 70MHz Input 110dB Channel Isolation at 100MHz Multiplexed or Separate Data Bus Flexible Input: 1VP-P to 2VP-P Range 575MHz Full Power Bandwidth S/H Clock Duty Cycle Stabilizer Shutdown and Nap Modes Pin Compatible Family 80Msps: LTC2294 (12-Bit), LTC2299 (14-Bit) 65Msps: LTC2293 (12-Bit), LTC2298 (14-Bit) 40Msps: LTC2292 (12-Bit), LTC2297 (14-Bit) 25Msps: LTC2291 (12-Bit), LTC2296 (14-Bit) 64-Pin (9mm x 9mm) QFN Package
The LTC(R)2299 is a 14-bit 80Msps, low power dual 3V A/D converter designed for digitizing high frequency, wide dynamic range signals. The LTC2299 is perfect for demanding imaging and communications applications with AC performance that includes 73dB SNR and 90dB SFDR for signals well beyond the Nyquist frequency. DC specs include 1.2LSB INL (typ), 0.5LSB DNL (typ) and 0.5LSB INL, 0.5LSB DNL over temperature. The transition noise is a low 1.2LSBRMS. A single 3V supply allows low power operation. A separate output supply allows the outputs to drive 0.5V to 3.3V logic. An optional multiplexer allows both channels to share a digital output bus. A single-ended CLK input controls converter operation. An optional clock duty cycle stabilizer allows high performance at full speed for a wide range of clock duty cycles.
, LTC and LT are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners.
APPLICATIO S

Wireless and Wired Broadband Communication Imaging Systems Spectral Analysis Portable Instrumentation
TYPICAL APPLICATIO
+
ANALOG INPUT A INPUT S/H
OVDD 14-BIT PIPELINED ADC CORE OUTPUT DRIVERS D13A
* * *
-
D0A OGND
SNR (dBFS)
CLK A
CLOCK/DUTY CYCLE CONTROL MUX CLOCK/DUTY CYCLE CONTROL
CLK B
OVDD
+
ANALOG INPUT B INPUT S/H
-
14-BIT PIPELINED ADC CORE
OUTPUT DRIVERS
D13B
* * *
D0B OGND
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SNR vs Input Frequency, -1dB, 2V Range
75 74 73 72 71 70 69 68 67 66 65 0 100 50 150 INPUT FREQUENCY (MHz) 200
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LTC2299
ABSOLUTE AXI U RATI GS
PACKAGE/ORDER I FOR ATIO
TOP VIEW
64 GND 63 VDD 62 SENSEA 61 VCMA 60 MODE 59 SHDNA 58 OEA 57 OFA 56 DA13 55 DA12 54 DA11 53 DA10 52 DA9 51 DA8 50 OGND 49 OVDD
OVDD = VDD (Notes 1, 2)
Supply Voltage (VDD) ................................................. 4V Digital Output Ground Voltage (OGND) ....... -0.3V to 1V Analog Input Voltage (Note 3) ..... -0.3V to (VDD + 0.3V) Digital Input Voltage .................... -0.3V to (VDD + 0.3V) Digital Output Voltage ................ -0.3V to (OVDD + 0.3V) Power Dissipation ............................................ 1500mW Operating Temperature Range LTC2299C ............................................... 0C to 70C LTC2299I .............................................-40C to 85C Storage Temperature Range ..................-65C to 125C Lead Temperature (Soldering, 10 sec).................. 300C
AINA+ 1 AINA- 2 REFHA 3 REFHA 4 REFLA 5 REFLA 6 VDD 7 CLKA 8 CLKB 9 VDD 10 REFLB 11 REFLB 12 REFHB 13 REFHB 14 AINB- 15 AINB+ 16
65
48 DA7 47 DA6 46 DA5 45 DA4 44 DA3 43 DA2 42 DA1 41 DA0 40 OFB 39 DB13 38 DB12 37 DB11 36 DB10 35 DB9 34 DB8 33 DB7
UP PACKAGE 64-LEAD (9mm x 9mm) PLASTIC QFN TJMAX = 125C, JA = 20C/W EXPOSED PAD (PIN 65) IS GND AND MUST BE SOLDERED TO PCB
ORDER PART NUMBER LTC2299CUP LTC2299IUP
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
CO VERTER CHARACTERISTICS The denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25C. (Note 4)
PARAMETER Resolution (No Missing Codes) Integral Linearity Error Differential Linearity Error Offset Error Gain Error Offset Drift Full-Scale Drift Gain Matching Offset Matching Transition Noise CONDITIONS
GND 17 VDD 18 SENSEB 19 VCMB 20 MUX 21 SHDNB 22 OEB 23 DB0 24 DB1 25 DB2 26 DB3 27 DB4 28 DB5 29 DB6 30 OGND 31 OVDD 32
QFN PART* MARKING LTC2299UP
MIN

TYP 1.2 0.5 2 0.5 10 30 15 0.3 2 1.2
MAX 5 1 12 2.5
UNITS Bits LSB LSB mV %FS V/C ppm/C ppm/C %FS mV LSBRMS
Differential Analog Input (Note 5) Differential Analog Input (Note 6) External Reference Internal Reference External Reference External Reference SENSE = 1V
14 -5 -1 -12 -2.5
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LTC2299
A ALOG I PUT
SYMBOL VIN VIN,CM IIN ISENSE IMODE tAP tJITTER CMRR PARAMETER
The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 4)
CONDITIONS 2.7V < VDD < 3.4V (Note 7) Differential Input (Note 7) 0V < AIN+, AIN- < VDD 0V < SENSEA, SENSEB < 1V 0V < MODE < VDD

Analog Input Range (AIN+ -AIN-) Analog Input Common Mode Analog Input Leakage Current SENSEA, SENSEB Input Leakage MODE Input Leakage Current Sample-and-Hold Acquisition Delay Time Sample-and-Hold Acquisition Delay Time Jitter Analog Input Common Mode Rejection Ratio Full Power Bandwidth
DY A IC ACCURACY
SYMBOL SNR PARAMETER Signal-to-Noise Ratio
The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. AIN = -1dBFS. (Note 4)
CONDITIONS 5MHz Input 40MHz Input 70MHz Input 140MHz Input
SFDR
Spurious Free Dynamic Range 2nd or 3rd Harmonic
SFDR
Spurious Free Dynamic Range 4th Harmonic or Higher
S/(N+D)
Signal-to-Noise Plus Distortion Ratio
IMD
Intermodulation Distortion Crosstalk
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MIN 1 -1 -3 -3
TYP 1V to 2V 1.5
MAX 1.9 1 3 3
UNITS V V A A A ns psRMS dB MHz
0 0.2 80 Figure 8 Test Circuit 575
MIN 70.1
TYP 73 73 73 72.6 90
MAX
UNITS dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB
5MHz Input 40MHz Input 70MHz Input 140MHz Input 5MHz Input 40MHz Input 70MHz Input 140MHz Input 5MHz Input 40MHz Input 70MHz Input 140MHz Input fIN = 40MHz, 41MHz fIN = 100MHz

74
90 90 85 90
80
90 90 90 72.9
69.5
72.8 72.8 72.1 90 -110
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LTC2299
I TER AL REFERE CE CHARACTERISTICS
PARAMETER VCM Output Voltage VCM Output Tempco VCM Line Regulation VCM Output Resistance CONDITIONS IOUT = 0
DIGITAL I PUTS A D DIGITAL OUTPUTS
SYMBOL VIH VIL IIN CIN LOGIC OUTPUTS OVDD = 3V COZ ISOURCE ISINK VOH VOL OVDD = 2.5V VOH VOL OVDD = 1.8V VOH VOL High Level Output Voltage Low Level Output Voltage IO = -200A IO = 1.6mA High Level Output Voltage Low Level Output Voltage IO = -200A IO = 1.6mA Hi-Z Output Capacitance Output Source Current Output Sink Current High Level Output Voltage Low Level Output Voltage PARAMETER High Level Input Voltage Low Level Input Voltage Input Current Input Capacitance CONDITIONS VDD = 3V VDD = 3V LOGIC INPUTS (CLK, OE, SHDN, MUX)
The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 4)
MIN

4
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(Note 4)
MIN 1.475 TYP 1.500 30 3 4 MAX 1.525 UNITS V ppm/C mV/V
2.7V < VDD < 3.4V -1mA < IOUT < 1mA
TYP
MAX
UNITS V
2 0.8 -10 3 10
V A pF
VIN = 0V to VDD (Note 7)
OE = High (Note 7) VOUT = 0V VOUT = 3V IO = -10A IO = -200A IO = 10A IO = 1.6mA

3 50 50 2.7 2.995 2.99 0.005 0.09 2.49 0.09 1.79 0.09 0.4
pF mA mA V V V V V V V V
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LTC2299
POWER REQUIRE E TS
SYMBOL VDD OVDD IVDD PDISS PSHDN PNAP PARAMETER Analog Supply Voltage Output Supply Voltage Supply Current Power Dissipation Shutdown Power (Each Channel) Nap Mode Power (Each Channel)
The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 8)
CONDITIONS (Note 9) (Note 9) Both ADCs at fS(MAX) Both ADCs at fS(MAX) SHDN = H, OE = H, No CLK SHDN = H, OE = L, No CLK

The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 4)
SYMBOL fs tL tH tAP tD tMD PARAMETER Sampling Frequency CLK Low Time CLK High Time Sample-and-Hold Aperture Delay CLK to DATA Delay MUX to DATA Delay Data Access Time After OE BUS Relinquish Time Pipeline Latency Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Note 2: All voltage values are with respect to ground with GND and OGND wired together (unless otherwise noted). Note 3: When these pin voltages are taken below GND or above VDD, they will be clamped by internal diodes. This product can handle input currents of greater than 100mA below GND or above VDD without latchup. Note 4: VDD = 3V, fSAMPLE = 80MHz, input range = 2VP-P with differential drive, unless otherwise noted. CL = 5pF (Note 7) CL = 5pF (Note 7) CL = 5pF (Note 7) (Note 7)

TI I G CHARACTERISTICS
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MIN 2.7 0.5
TYP 3 3 148 444 2 15
MAX 3.4 3.6 172 516
UNITS V V mA mW mW mW
UW
CONDITIONS (Note 9) Duty Cycle Stabilizer Off Duty Cycle Stabilizer On (Note 9) Duty Cycle Stabilizer Off Duty Cycle Stabilizer On (Note 9)

MIN 1 5.9 5 5.9 5 1.4 1.4
TYP 6.25 6.25 6.25 6.25 0 2.7 2.7 4.3 3.3 6
MAX 80 500 500 500 500 5.4 5.4 10 8.5
UNITS MHz ns ns ns ns ns ns ns ns ns Cycles
Note 5: Integral nonlinearity is defined as the deviation of a code from a straight line passing through the actual endpoints of the transfer curve. The deviation is measured from the center of the quantization band. Note 6: Offset error is the offset voltage measured from -0.5 LSB when the output code flickers between 00 0000 0000 0000 and 11 1111 1111 1111. Note 7: Guaranteed by design, not subject to test. Note 8: VDD = 3V, fSAMPLE = 80MHz, input range = 1VP-P with differential drive. The supply current and power dissipation are the sum total for both channels with both channels active. Note 9: Recommended operating conditions.
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LTC2299 TYPICAL PERFOR A CE CHARACTERISTICS
Crosstalk vs Input Frequency
-100 -105
2.0 1.5 1.0
-110 -115 -120 -125 -130 0 20 40 60 80 INPUT FREQUENCY (MHz) 100
2299 G01
0.5 0 -0.5 -1.0 -1.5 -2.0 0 4096 8192 CODE
2299 G02
DNL ERROR (LSB)
CROSSTALK (dB)
INL ERROR (LSB)
8192 Point FFT, fIN = 5MHz, -1dB, 2V Range, 80Msps
0 -10 -20 -30
AMPLITUDE (dB) AMPLITUDE (dB)
0 -10 -20 -30 -50 -60 -70 -80 -90 -100 -110 -120
-50 -60 -70 -80 -90 -100 -110 -120 0 5 10 15 20 25 30 FREQUENCY (MHz) 35 40
AMPLITUDE (dB)
-40
8192 Point FFT, fIN = 140MHz, -1dB, 2V Range, 80Msps
0 -10 -20 -30
AMPLITUDE (dB) AMPLITUDE (dB)
-40 -50 -60 -70 -80 -90 -100 -110 -120 0 5 10 15 20 25 30 FREQUENCY (MHz) 35 40
COUNT
6
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Typical INL, 2V Range, 80Msps
1.0 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1.0 12288 16384
Typical DNL, 2V Range, 80Msps
0
4096
8192 CODE
12288
16384
2299 G03
8192 Point FFT, fIN = 30MHz, -1dB, 2V Range, 80Msps
0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 0 5 10 15 20 25 30 FREQUENCY (MHz) 35 40 -120
8192 Point FFT, fIN = 70MHz, -1dB, 2V Range, 80Msps
-40
0
5
10
15 20 25 30 FREQUENCY (MHz)
35
40
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2299 G05
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8192 Point 2-Tone FFT, fIN = 28.2MHz and 26.8MHz, -1dB, 2V Range
0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 0 5 10 15 20 25 30 FREQUENCY (MHz) 35 40
50000 45000 40000 35000 30000 25000 20000 15000 10000 5000 0
Grounded Input Histogram, 80Msps
43161 35969
25292
12558 5194 26 552 8201 8203 8205 8207 CODE 6150 1987 178 8209
2299 G09
2299 G07
2299 G08
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LTC2299 TYPICAL PERFOR A CE CHARACTERISTICS
SNR vs Input Frequency, -1dB, 2V Range, 80Msps
75 74 73
SNR AND SFDR (dBFS)
72
SFDR (dBFS)
SNR (dBFS)
71 70 69 68 67 66 65 0 100 50 150 INPUT FREQUENCY (MHz) 200
2299 G10
SNR and SFDR vs Clock Duty Cycle, 80Msps
95 SFDR: DCS ON
80 70
90
SNR AND SFDR (dBFS)
SFDR: DCS OFF 85
SNR (dBc AND dBFS)
SFDR (dBc AND dBFS)
80
75
SNR: DCS ON SNR: DCS OFF
70 30 35 40 60 CLOCK DUTY CYCLE (%) 45 50 55 65 70
IVDD vs Sample Rate, 5MHz Sine Wave Input, -1dB
165 155
14 12
IOVDD (mA)
IVDD (mA)
145 2V RANGE 135 1V RANGE 125 115 105 95 0 10 20 30 40 50 60 70 80 90 100 SAMPLE RATE (Msps)
2299 G16
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2299 G13
SFDR vs Input Frequency, -1dB, 2V Range, 80Msps
100 95 90 90 85 80 75 70 65 0 50 150 INPUT FREQUENCY (MHz) 100 200
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SNR and SFDR vs Sample Rate, 2V Range, fIN = 5MHz, -1dB
100
SFDR 80 SNR 70
60
50
0 10 20 30 40 50 60 70 80 90 100 110 SAMPLE RATE (Msps)
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SNR vs Input Level, fIN = 70MHz, 2V Range, 80Msps
120
SFDR vs Input Level, fIN = 70MHz, 2V Range, 80Msps
110 100 90 80 70 60 50 40 30 20 10 100dBc SFDR REFERENCE LINE dBc dBFS
dBFS
60 50 40 30 20 10 0 -70 -60 -50 -40 -30 -20 INPUT LEVEL (dBFS) -10 0 dBc
0 -80
-40 -60 -20 INPUT LEVEL (dBFS)
0
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IOVDD vs Sample Rate, 5MHz Sine Wave Input, -1dB, OVDD = 1.8V
10 8 6 4 2 0 0 10 20 30 40 50 60 70 80 90 100 SAMPLE RATE (Msps)
2299 G17
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LTC2299
PI FU CTIO S
AINA+ (Pin 1): Channel A Positive Differential Analog Input. AINA- (Pin 2): Channel A Negative Differential Analog Input. REFHA (Pins 3, 4): Channel A High Reference. Short together and bypass to Pins 5, 6 with a 0.1F ceramic chip capacitor as close to the pin as possible. Also bypass to Pins 5, 6 with an additional 2.2F ceramic chip capacitor and to ground with a 1F ceramic chip capacitor. REFLA (Pins 5, 6): Channel A Low Reference. Short together and bypass to Pins 3, 4 with a 0.1F ceramic chip capacitor as close to the pin as possible. Also bypass to Pins 3, 4 with an additional 2.2F ceramic chip capacitor and to ground with a 1F ceramic chip capacitor. VDD (Pins 7, 10, 18, 63): Analog 3V Supply. Bypass to GND with 0.1F ceramic chip capacitors. CLKA (Pin 8): Channel A Clock Input. The input sample starts on the positive edge. CLKB (Pin 9): Channel B Clock Input. The input sample starts on the positive edge. REFLB (Pins 11, 12): Channel B Low Reference. Short together and bypass to Pins 13, 14 with a 0.1F ceramic chip capacitor as close to the pin as possible. Also bypass to Pins 13, 14 with an additional 2.2F ceramic chip capacitor and to ground with a 1F ceramic chip capacitor. REFHB (Pins 13, 14): Channel B High Reference. Short together and bypass to Pins 11, 12 with a 0.1F ceramic chip capacitor as close to the pin as possible. Also bypass to Pins 11, 12 with an additional 2.2F ceramic chip capacitor and to ground with a 1F ceramic chip capacitor. AINB- (Pin 15): Channel B Negative Differential Analog Input. AINB (Pin 16): Channel B Positive Differential Analog Input. GND (Pins 17, 64): ADC Power Ground. SENSEB (Pin 19): Channel B Reference Programming Pin. Connecting SENSEB to VCMB selects the internal reference and a 0.5V input range. VDD selects the internal reference
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and a 1V input range. An external reference greater than 0.5V and less than 1V applied to SENSEB selects an input range of VSENSEB. 1V is the largest valid input range. VCMB (Pin 20): Channel B 1.5V Output and Input Common Mode Bias. Bypass to ground with 2.2F ceramic chip capacitor. Do not connect to VCMA. MUX (Pin 21): Digital Output Multiplexer Control. If MUX is High, Channel A comes out on DA0-DA13, OFA; Channel B comes out on DB0-DB13, OFB. If MUX is Low, the output busses are swapped and Channel A comes out on DB0DB13, OFB; Channel B comes out on DA0-DA13, OFA. To multiplex both channels onto a single output bus, connect MUX, CLKA and CLKB together. SHDNB (Pin 22): Channel B Shutdown Mode Selection Pin. Connecting SHDNB to GND and OEB to GND results in normal operation with the outputs enabled. Connecting SHDNB to GND and OEB to VDD results in normal operation with the outputs at high impedance. Connecting SHDNB to VDD and OEB to GND results in nap mode with the outputs at high impedance. Connecting SHDNB to VDD and OEB to VDD results in sleep mode with the outputs at high impedance. OEB (Pin 23): Channel B Output Enable Pin. Refer to SHDNB pin function. DB0 - DB13 (Pins 24 to 30, 33 to 39): Channel B Digital Outputs. DB13 is the MSB. OGND (Pins 31, 50): Output Driver Ground. OVDD (Pins 32, 49): Positive Supply for the Output Drivers. Bypass to ground with 0.1F ceramic chip capacitor. OFB (Pin 40): Channel B Overflow/Underflow Output. High when an overflow or underflow has occurred. DA0 - DA13 (Pins 41 to 48, 51 to 56): Channel A Digital Outputs. DA13 is the MSB. OFA (Pin 57): Channel A Overflow/Underflow Output. High when an overflow or underflow has occurred. OEA (Pin 58): Channel A Output Enable Pin. Refer to SHDNA pin function.
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PI FU CTIO S
SHDNA (Pin 59): Channel A Shutdown Mode Selection Pin. Connecting SHDNA to GND and OEA to GND results in normal operation with the outputs enabled. Connecting SHDNA to GND and OEA to VDD results in normal operation with the outputs at high impedance. Connecting SHDNA to VDD and OEA to GND results in nap mode with the outputs at high impedance. Connecting SHDNA to VDD and OEA to VDD results in sleep mode with the outputs at high impedance. MODE (Pin 60): Output Format and Clock Duty Cycle Stabilizer Selection Pin. Note that MODE controls both channels. Connecting MODE to GND selects straight binary output format and turns the clock duty cycle stabilizer off. 1/3 VDD selects straight binary output format and turns the clock duty cycle stabilizer on. 2/3 VDD selects 2's complement output format and turns the clock duty cycle stabilizer on. VDD selects 2's complement output format and turns the clock duty cycle stabilizer off. VCMA (Pin 61): Channel A 1.5V Output and Input Common Mode Bias. Bypass to ground with 2.2F ceramic chip capacitor. Do not connect to VCMB. SENSEA (Pin 62): Channel A Reference Programming Pin. Connecting SENSEA to VCMA selects the internal reference and a 0.5V input range. VDD selects the internal reference and a 1V input range. An external reference greater than 0.5V and less than 1V applied to SENSEA selects an input range of VSENSEA. 1V is the largest valid input range. GND (Exposed Pad) (Pin 65): ADC Power Ground. The Exposed Pad on the bottom of the package needs to be soldered to ground.
FUNCTIONAL BLOCK DIAGRA
AIN+ INPUT S/H FIRST PIPELINED ADC STAGE SECOND PIPELINED ADC STAGE AIN-
VCM 2.2F
1.5V REFERENCE
RANGE SELECT
REFH SENSE REF BUF
DIFF REF AMP
REFH
0.1F
2.2F 1F 1F
Figure 1. Functional Block Diagram (Only One Channel is Shown)
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THIRD PIPELINED ADC STAGE
FOURTH PIPELINED ADC STAGE
FIFTH PIPELINED ADC STAGE
SIXTH PIPELINED ADC STAGE
SHIFT REGISTER AND CORRECTION
REFL
INTERNAL CLOCK SIGNALS OVDD OF CLOCK/DUTY CYCLE CONTROL D13 CONTROL LOGIC OUTPUT DRIVERS * * * D0
REFL CLK MODE SHDN OE
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OGND
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LTC2299
TI I G DIAGRA S
Dual Digital Output Bus Timing (Only One Channel is Shown)
tAP ANALOG INPUT N N+1 tH CLK tD D0-D13, OF N-6 N-5 N-4 N-3 N-2 N-1
2299 TD01
ANALOG INPUT A
ANALOG INPUT B
CLKA = CLKB = MUX
D0A-D13A, OFA
D0B-D13B, OFB
10
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N+2 N+3
N+4 N+5
tL
Multiplexed Digital Output Bus Timing
tAPA A A+1 tAPB B B+1 tH tL B+2 B+3 B+4 A+2 A+3 A+4
A-6 tD B-6
B-6
A-5
B-5 t MD
A-4
B-4
A-3
B-3
A-2
A-6
B-5
A-5
B-4
A-4
B-3
A-3
B-2
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APPLICATIO S I FOR ATIO
DYNAMIC PERFORMANCE Signal-to-Noise Plus Distortion Ratio The signal-to-noise plus distortion ratio [S/(N + D)] is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components at the ADC output. The output is band limited to frequencies above DC to below half the sampling frequency. Signal-to-Noise Ratio The signal-to-noise ratio (SNR) is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components except the first five harmonics and DC. Total Harmonic Distortion Total harmonic distortion is the ratio of the RMS sum of all harmonics of the input signal to the fundamental itself. The out-of-band harmonics alias into the frequency band between DC and half the sampling frequency. THD is expressed as: THD = 20Log (V22 + V32 + V42 + . . . Vn2)/V1 where V1 is the RMS amplitude of the fundamental frequency and V2 through Vn are the amplitudes of the second through nth harmonics. The THD calculated in this data sheet uses all the harmonics up to the fifth. Intermodulation Distortion If the ADC input signal consists of more than one spectral component, the ADC transfer function nonlinearity can produce intermodulation distortion (IMD) in addition to THD. IMD is the change in one sinusoidal input caused by the presence of another sinusoidal input at a different frequency. If two pure sine waves of frequencies fa and fb are applied to the ADC input, nonlinearities in the ADC transfer function can create distortion products at the sum and difference frequencies of mfa nfb, where m and n = 0, 1, 2, 3, etc. The 3rd order intermodulation products are 2fa + fb, Aperture Delay Time The time from when CLK reaches midsupply to the instant that the input signal is held by the sample and hold circuit. Aperture Delay Jitter The variation in the aperture delay time from conversion to conversion. This random variation will result in noise when sampling an AC input. The signal to noise ratio due to the jitter alone will be: SNRJITTER = -20log (2) * fIN * tJITTER Crosstalk Crosstalk is the coupling from one channel (being driven by a full-scale signal) onto the other channel (being driven by a -1dBFS signal). CONVERTER OPERATION As shown in Figure 1, the LTC2299 is a dual CMOS pipelined multistep converter. The converter has six pipelined ADC stages; a sampled analog input will result in a digitized value six cycles later (see the Timing Diagram section). For optimal AC performance the analog inputs should be driven differentially. For cost sensitive
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2fb + fa, 2fa - fb and 2fb - fa. The intermodulation distortion is defined as the ratio of the RMS value of either input tone to the RMS value of the largest 3rd order intermodulation product. Spurious Free Dynamic Range (SFDR) Spurious free dynamic range is the peak harmonic or spurious noise that is the largest spectral component excluding the input signal and DC. This value is expressed in decibels relative to the RMS value of a full scale input signal. Input Bandwidth The input bandwidth is that input frequency at which the amplitude of the reconstructed fundamental is reduced by 3dB for a full scale input signal.
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LTC2299
APPLICATIO S I FOR ATIO
applications, the analog inputs can be driven single-ended with slightly worse harmonic distortion. The CLK input is single-ended. The LTC2299 has two phases of operation, determined by the state of the CLK input pin. Each pipelined stage shown in Figure 1 contains an ADC, a reconstruction DAC and an interstage residue amplifier. In operation, the ADC quantizes the input to the stage and the quantized value is subtracted from the input by the DAC to produce a residue. The residue is amplified and output by the residue amplifier. Successive stages operate out of phase so that when the odd stages are outputting their residue, the even stages are acquiring that residue and vice versa. When CLK is low, the analog input is sampled differentially directly onto the input sample-and-hold capacitors, inside the "Input S/H" shown in the block diagram. At the instant that CLK transitions from low to high, the sampled input is held. While CLK is high, the held input voltage is buffered by the S/H amplifier which drives the first pipelined ADC stage. The first stage acquires the output of the S/H during this high phase of CLK. When CLK goes back low, the first stage produces its residue which is acquired by the second stage. At the same time, the input S/H goes back to acquiring the analog input. When CLK goes back high, the second stage produces its residue which is acquired by the third stage. An identical process is repeated for the
LTC2299 VDD 15 CPARASITIC 1pF CSAMPLE 4pF CPARASITIC 1pF VDD CLK CSAMPLE 4pF
AIN+
VDD 15
AIN-
Figure 2. Equivalent Input Circuit
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third, fourth and fifth stages, resulting in a fifth stage residue that is sent to the sixth stage ADC for final evaluation. Each ADC stage following the first has additional range to accommodate flash and amplifier offset errors. Results from all of the ADC stages are digitally synchronized such that the results can be properly combined in the correction logic before being sent to the output buffer. SAMPLE/HOLD OPERATION AND INPUT DRIVE Sample/Hold Operation Figure 2 shows an equivalent circuit for the LTC2299 CMOS differential sample-and-hold. The analog inputs are connected to the sampling capacitors (CSAMPLE) through NMOS transistors. The capacitors shown attached to each input (CPARASITIC) are the summation of all other capacitance associated with each input. During the sample phase when CLK is low, the transistors connect the analog inputs to the sampling capacitors and they charge to and track the differential input voltage. When CLK transitions from low to high, the sampled input voltage is held on the sampling capacitors. During the hold phase when CLK is high, the sampling capacitors are disconnected from the input and the held voltage is passed to the ADC core for processing. As CLK transitions from
2299 F02
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LTC2299
APPLICATIO S I FOR ATIO
high to low, the inputs are reconnected to the sampling capacitors to acquire a new sample. Since the sampling capacitors still hold the previous sample, a charging glitch proportional to the change in voltage between samples will be seen at this time. If the change between the last sample and the new sample is small, the charging glitch seen at the input will be small. If the input change is large, such as the change seen with input frequencies near Nyquist, then a larger charging glitch will be seen. Single-Ended Input For cost sensitive applications, the analog inputs can be driven single-ended. With a single-ended input the harmonic distortion and INL will degrade, but the SNR and DNL will remain unchanged. For a single-ended input, AIN+ should be driven with the input signal and AIN- should be connected to 1.5V or VCM. Common Mode Bias For optimal performance the analog inputs should be driven differentially. Each input should swing 0.5V for the 2V range or 0.25V for the 1V range, around a common mode voltage of 1.5V. The VCM output pin may be used to provide the common mode bias level. VCM can be tied directly to the center tap of a transformer to set the DC input level or as a reference level to an op amp differential driver circuit. The VCM pin must be bypassed to ground close to the ADC with a 2.2F or greater capacitor. Input Drive Impedance As with all high performance, high speed ADCs, the dynamic performance of the LTC2299 can be influenced by the input drive circuitry, particularly the second and third harmonics. Source impedance and reactance can influence SFDR. At the falling edge of CLK, the sampleand-hold circuit will connect the 4pF sampling capacitor to the input pin and start the sampling period. The sampling period ends when CLK rises, holding the sampled input on the sampling capacitor. Ideally the input circuitry should be fast enough to fully charge the sampling capacitor during the sampling period 1/(2FENCODE); however, this is not always possible and the incomplete settling may
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degrade the SFDR. The sampling glitch has been designed to be as linear as possible to minimize the effects of incomplete settling. For the best performance, it is recommended to have a source impedance of 100 or less for each input. The source impedance should be matched for the differential inputs. Poor matching will result in higher even order harmonics, especially the second. Input Drive Circuits Figure 3 shows the LTC2299 being driven by an RF transformer with a center tapped secondary. The secondary center tap is DC biased with VCM, setting the ADC input signal at its optimum DC level. Terminating on the transformer secondary is desirable, as this provides a common mode path for charging glitches caused by the sample and hold. Figure 3 shows a 1:1 turns ratio transformer. Other turns ratios can be used if the source impedance seen by the ADC does not exceed 100 for each ADC input. A disadvantage of using a transformer is the loss of low frequency response. Most small RF transformers have poor performance at frequencies below 1MHz.
VCM 2.2F 0.1F ANALOG INPUT T1 1:1 25 25 T1 = MA/COM ETC1-1T 25 RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE 25 0.1F 12pF AIN-
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AIN+
LTC2299
Figure 3. Single-Ended to Differential Conversion Using a Transformer
Figure 4 demonstrates the use of a differential amplifier to convert a single ended input signal into a differential input signal. The advantage of this method is that it provides low frequency input response; however, the limited gain bandwidth of most op amps will limit the SFDR at high input frequencies.
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LTC2299
APPLICATIO S I FOR ATIO
VCM HIGH SPEED DIFFERENTIAL 25 AMPLIFIER ANALOG INPUT 2.2F AIN+ 0.1F LTC2299 ANALOG INPUT 25 12pF T1 0.1F 25 12 12 0.1F 8pF AIN-
2299 F06
+
CM
+ -
25 AIN-
2299 F04
-
Figure 4. Differential Drive with an Amplifier
Figure 5 shows a single-ended input circuit. The impedance seen by the analog inputs should be matched. This circuit is not recommended if low distortion is required.
VCM 1k 0.1F ANALOG INPUT 1k 25 2.2F AIN+ LTC2299
12pF 25 0.1F AIN-
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Figure 5. Single-Ended Drive
The 25 resistors and 12pF capacitor on the analog inputs serve two purposes: isolating the drive circuitry from the sample-and-hold charging glitches and limiting the wideband noise at the converter input. For input frequencies above 70MHz, the input circuits of Figure 6, 7 and 8 are recommended. The balun transformer gives better high frequency response than a flux coupled center tapped transformer. The coupling capacitors allow the analog inputs to be DC biased at 1.5V. In Figure 8, the series inductors are impedance matching elements that maximize the ADC bandwidth.
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VCM 2.2F AIN+ LTC2299 T1 = MA/COM, ETC 1-1-13 RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE
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Figure 6. Recommended Front End Circuit for Input Frequencies Between 70MHz and 170MHz
VCM 2.2F 0.1F ANALOG INPUT 25 T1 0.1F 25 T1 = MA/COM, ETC 1-1-13 RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE AIN-
2299 F07
AIN+ 0.1F
LTC2299
Figure 7. Recommended Front End Circuit for Input Frequencies Between 170MHz and 300MHz
VCM 2.2F 0.1F ANALOG INPUT 25 T1 0.1F 25 6.8nH
-
2299 F08
6.8nH 0.1F
AIN+
LTC2299
AIN T1 = MA/COM, ETC 1-1-13 RESISTORS, CAPACITORS, INDUCTORS ARE 0402 PACKAGE SIZE
Figure 8. Recommended Front End Circuit for Input Frequencies Above 300MHz
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LTC2299
APPLICATIO S I FOR ATIO
Reference Operation Figure 9 shows the LTC2299 reference circuitry consisting of a 1.5V bandgap reference, a difference amplifier and switching and control circuit. The internal voltage reference can be configured for two pin selectable input ranges of 2V (1V differential) or 1V (0.5V differential). Tying the SENSE pin to VDD selects the 2V range; tying the SENSE pin to VCM selects the 1V range. The 1.5V bandgap reference serves two functions: its output provides a DC bias point for setting the common mode voltage of any external input circuitry; additionally, the reference is used with a difference amplifier to generate the differential reference levels needed by the internal ADC circuitry. An external bypass capacitor is required for the 1.5V reference output, VCM. This provides a high frequency low impedance path to ground for internal and external circuitry.
LTC2299 1.5V VCM 2.2F 1V RANGE DETECT AND CONTROL SENSE BUFFER INTERNAL ADC HIGH REFERENCE REFH 0.5V 4 1.5V BANDGAP REFERENCE
1.5V VCM 2.2F 12k 0.75V 12k SENSE 1F LTC2299
TIE TO VDD FOR 2V RANGE; TIE TO VCM FOR 1V RANGE; RANGE = 2 * VSENSE FOR 0.5V < VSENSE < 1V 1F
2.2F
0.1F
DIFF AMP
1F REFL INTERNAL ADC LOW REFERENCE
2299 F09
Figure 9. Equivalent Reference Circuit
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The difference amplifier generates the high and low reference for the ADC. High speed switching circuits are connected to these outputs and they must be externally bypassed. Each output has two pins. The multiple output pins are needed to reduce package inductance. Bypass capacitors must be connected as shown in Figure 9. Each ADC channel has an independent reference with its own bypass capacitors. The two channels can be used with the same or different input ranges. Other voltage ranges between the pin selectable ranges can be programmed with two external resistors as shown in Figure 10. An external reference can be used by applying its output directly or through a resistor divider to SENSE. It is not recommended to drive the SENSE pin with a logic device. The SENSE pin should be tied to the appropriate level as close to the converter as possible. If the SENSE pin is driven externally, it should be bypassed to ground as close to the device as possible with a 1F ceramic capacitor. For the best channel matching, connect an external reference to SENSEA and SENSEB.
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Figure 10. 1.5V Range ADC
Input Range The input range can be set based on the application. The 2V input range will provide the best signal-to-noise performance while maintaining excellent SFDR. The 1V input range will have better SFDR performance, but the SNR will degrade by 5.7dB. See the Typical Performance Characteristics section. Driving the Clock Input The CLK inputs can be driven directly with a CMOS or TTL level signal. A sinusoidal clock can also be used along with a low jitter squaring circuit before the CLK pin (Figure 11).
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LTC2299
APPLICATIO S I FOR ATIO
4.7F FERRITE BEAD 0.1F SINUSOIDAL CLOCK INPUT 0.1F 1k CLK 50 1k NC7SVU04 CLEAN SUPPLY
LTC2299
Figure 11. Sinusoidal Single-Ended CLK Drive
The noise performance of the LTC2299 can depend on the clock signal quality as much as on the analog input. Any noise present on the clock signal will result in additional aperture jitter that will be RMS summed with the inherent ADC aperture jitter. In applications where jitter is critical, such as when digitizing high input frequencies, use as large an amplitude as possible. Also, if the ADC is clocked with a sinusoidal signal, filter the CLK signal to reduce wideband noise and distortion products generated by the source. It is recommended that CLKA and CLKB are shorted together and driven by the same clock source. If a small time delay is desired between when the two channels sample the analog inputs, CLKA and CLKB can be driven by two different signals. If this delay exceeds 1ns, the performance of the part may degrade. CLKA and CLKB should not be driven by asynchronous signals. Maximum and Minimum Conversion Rates The maximum conversion rate for the LTC2299 is 80Msps. For the ADC to operate properly, the CLK signal should have a 50% (5%) duty cycle. Each half cycle must have at least 5.9ns for the ADC internal circuitry to have enough settling time for proper operation.
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An optional clock duty cycle stabilizer circuit can be used if the input clock has a non 50% duty cycle. This circuit uses the rising edge of the CLK pin to sample the analog input. The falling edge of CLK is ignored and the internal falling edge is generated by a phase-locked loop. The input clock duty cycle can vary from 40% to 60% and the clock duty cycle stabilizer will maintain a constant 50% internal duty cycle. If the clock is turned off for a long period of time, the duty cycle stabilizer circuit will require a hundred clock cycles for the PLL to lock onto the input clock. To use the clock duty cycle stabilizer, the MODE pin should be connected to 1/3VDD or 2/3VDD using external resistors. The MODE pin controls both Channel A and Channel B--the duty cycle stabilizer is either on or off for both channels. The lower limit of the LTC2299 sample rate is determined by droop of the sample-and-hold circuits. The pipelined architecture of this ADC relies on storing analog signals on small valued capacitors. Junction leakage will discharge the capacitors. The specified minimum operating frequency for the LTC2299 is 1Msps. DIGITAL OUTPUTS Digital Output Buffers Figure 12 shows an equivalent circuit for a single output buffer. Each buffer is powered by OVDD and OGND, isolated from the ADC power and ground. The additional N-channel transistor in the output driver allows operation down to low voltages. The internal resistor in series with the output makes the output appear as 50 to external circuitry and may eliminate the need for external damping resistors. As with all high speed/high resolution converters, the digital output loading can affect the performance. The digital outputs of the LTC2299 should drive a minimal capacitive load to avoid possible interaction between the
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LTC2299
APPLICATIO S I FOR ATIO
LTC2299
VDD
DATA FROM LATCH OE
PREDRIVER LOGIC
Figure 12. Digital Output Buffer
digital outputs and sensitive input circuitry. The output should be buffered with a device such as an ALVCH16373 CMOS latch. For full speed operation the capacitive load should be kept under 10pF. Lower OVDD voltages will also help reduce interference from the digital outputs. Data Format Using the MODE pin, the LTC2299 parallel digital output can be selected for offset binary or 2's complement format. Note that MODE controls both Channel A and Channel B. Connecting MODE to GND or 1/3VDD selects straight binary output format. Connecting MODE to 2/3VDD or VDD selects 2's complement output format. An external resistor divider can be used to set the 1/3VDD or 2/3VDD logic values. Table 1 shows the logic states for the MODE pin.
Table 1. MODE Pin Function
MODE Pin 0 1/3VDD 2/3VDD VDD Output Format Straight Binary Straight Binary 2's Complement 2's Complement Clock Duty Cycle Stabilizer Off On On Off
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OVDD VDD 0.5V TO VDD 0.1F OVDD 43 TYPICAL DATA OUTPUT OGND
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Overflow Bit When OF outputs a logic high the converter is either overranged or underranged. Output Driver Power Separate output power and ground pins allow the output drivers to be isolated from the analog circuitry. The power supply for the digital output buffers, OVDD, should be tied to the same power supply as for the logic being driven. For example, if the converter is driving a DSP powered by a 1.8V supply, then OVDD should be tied to that same 1.8V supply. OVDD can be powered with any voltage from 500mV up to 3.6V. OGND can be powered with any voltage from GND up to 1V and must be less than OVDD. The logic outputs will swing between OGND and OVDD. Output Enable The outputs may be disabled with the output enable pin, OE. OE high disables all data outputs including OF. The data access and bus relinquish times are too slow to allow the outputs to be enabled and disabled during full speed operation. The output Hi-Z state is intended for use during long periods of inactivity. Channels A and B have independent output enable pins (OEA, OEB).
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LTC2299
APPLICATIO S I FOR ATIO
Sleep and Nap Modes
The converter may be placed in shutdown or nap modes to conserve power. Connecting SHDN to GND results in normal operation. Connecting SHDN to VDD and OE to VDD results in sleep mode, which powers down all circuitry including the reference and typically dissipates 1mW. When exiting sleep mode it will take milliseconds for the output data to become valid because the reference capacitors have to recharge and stabilize. Connecting SHDN to VDD and OE to GND results in nap mode, which typically dissipates 30mW. In nap mode, the on-chip reference circuit is kept on, so that recovery from nap mode is faster than that from sleep mode, typically taking 100 clock cycles. In both sleep and nap modes, all digital outputs are disabled and enter the Hi-Z state. Channels A and B have independent SHDN pins (SHDNA, SHDNB). Channel A is controlled by SHDNA and OEA, and Channel B is controlled by SHDNB and OEB. The nap, sleep and output enable modes of the two channels are completely independent, so it is possible to have one channel operating while the other channel is in nap or sleep mode. Digital Output Mulitplexer The digital outputs of the LTC2299 can be multiplexed onto a single data bus. The MUX pin is a digital input that swaps the two data busses. If MUX is High, Channel A comes out on DA0-DA13, OFA; Channel B comes out on DB0-DB13, OFB. If MUX is Low, the output busses are swapped and Channel A comes out on DB0-DB13, OFB; Channel B comes out on DA0-DA13, OFA. To multiplex both channels onto a single output bus, connect MUX, CLKA and CLKB together (see the Timing Diagram for the multiplexed mode). The multiplexed data is available on either data bus--the unused data bus can be disabled with its OE pin.
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Grounding and Bypassing The LTC2299 requires a printed circuit board with a clean, unbroken ground plane. A multilayer board with an internal ground plane is recommended. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. High quality ceramic bypass capacitors should be used at the VDD, OVDD, VCM, REFH, and REFL pins. Bypass capacitors must be located as close to the pins as possible. Of particular importance is the 0.1F capacitor between REFH and REFL. This capacitor should be placed as close to the device as possible (1.5mm or less). A size 0402 ceramic capacitor is recommended. The large 2.2F capacitor between REFH and REFL can be somewhat further away. The traces connecting the pins and bypass capacitors must be kept short and should be made as wide as possible. The LTC2299 differential inputs should run parallel and close to each other. The input traces should be as short as possible to minimize capacitance and to minimize noise pickup. Heat Transfer Most of the heat generated by the LTC2299 is transferred from the die through the bottom-side exposed pad and package leads onto the printed circuit board. For good electrical and thermal performance, the exposed pad should be soldered to a large grounded pad on the PC board. It is critical that all ground pins are connected to a ground plane of sufficient area.
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VCC JP1 MODE VDD 1 2 4 6 8 C1 0.1F 16 15 17 19 21 23 25 27 29 31 34 36 33 35 RN1A 33 RN1B 33 18 20 22 24 26 28 30 32 C2 2.2F 2 4 6 1 3 5 R1 1k 3 5 7 GND 1/3VDD 2/3VDD R2 1k R3 1k C44 0.1F 74VCX245BQX VDD J1 EDGE-CON-100
JP2 SENSEA
VDD
1
VDD
2
8 10 12 14 7 9 11 13
E1 EXT REF A
EXT REF 5 6
20 VCC 11 9 A7 B7 12 8 A6 B6 13 7 B5 A5 14 6 A4 B4 15 5 U2 B3 A3 16 4 A2 B2 17 3 A1 B1 18 2 A0 B0 1 T/R 19 10 OE GND
J2 ANALOG R4 INPUT A OPT VDD VCC C6 *
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
C3 0.1F C4 0.1F RN3A 33 RN3B 33 RN3C 33 RN3D 33 RN4A 33 RN4B 33 RN4C 33 VCC C5 0.1F
T1 *
R5 *
5
1
2
R6 24.9
4
GND VDD SENSEA VCMA MODE SHDNA OEA OFA DA13 DA12 DA11 DA10 DA9 DA8 OGND OVDD
*
*3
R7 24.9
RN1C 33 RN1D 33 RN2A 33 RN2B 33 RN2C 33 RN2D 33
R8 51 C9 1F C10 2.2F C13 1F U1 LTC2299 74VCX245BQX VCC C11 0.1F
L1 BEAD
C12 4.7F 6.3V
VCMA
APPLICATIO S I FOR ATIO
VDD
R9 * C8 0.1F VDD
38 40 42 44 46 48 50 52 54 56 58 60 62
37 39 41 43 45 47 49 51 53 55 57 59 61 64 66 68 70 63 65 67 69
C14 0.1F
VDD C18 1F C20 2.2F C21 0.1F RN5A 33 RN5B 33 RN5C 33 RN5D 33 RN6A 33 RN6B 33 RN6C 33 RN6D 33 C23 1F
GND VDD SENSEB VCMB MUX SHDNB OEB DB0 DB1 DB2 DB3 DB4 DB5 DB6 OGND OVDD
20 VCC 11 9 A7 B7 12 8 A6 B6 13 7 B5 A5 14 6 A4 B4 15 5 U9 B3 A3 16 4 A2 B2 17 3 A1 B1 18 2 B0 A0 1 T/R 19 10 OE GND
J3 CLOCK INPUT
C19 0.1F
5
2
4
C17 0.1F
R14 49.9 VDD
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
5
C22 0.1F
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 AINA+ AINA- REFHA REFHA REFLA REFLA VDD CLKA CLKB VDD REFLB REFLB REFHB REFHB AINB- AINB+ DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 OFB DB13 DB12 DB11 DB10 DB9 DB8 DB7 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
R15 3 1k U3 NC7SVU04 R39 OPT VCC VDD R18 * VCMB R20 24.9 JP3 SENSE C31 * VDD VCMB EXT REF 5 6 C35 0.1F 3 4 VCM 1 2 VDD R22 24.9 R24 * C34 0.1F E2 EXT REF B C28 2.2F C27 0.1F C25 0.1F
2
4
R32 OPT
U6 3 NC7SVU04
R16 33
72 74
71 73
J4 R17 ANALOG OPT INPUT B
C29 0.1F
T2 *
4
1
2
20 VCC 11 9 A7 B7 12 8 A6 B6 13 7 B5 A5 14 6 A4 B4 15 5 U10 B3 A3 16 4 A2 B2 17 3 A1 B1 18 2 A0 B0 1 T/R 19 10 OE GND 74VCX245BQX VCC 20 9 8 7 6 5 4 3 2 19 C39 1F T/R OE GND 74VCX245BQX 1 10 RN7A 33 RN7B 33 RN7C 33
76 78 80 82
75 77 79 81
5
*
*3
VSS SCL 92 94 96 98 RN7D 33 RN8A 33 RN8B 33 VCC 5 4 U4 NC7SV86P5X E4 GND 3 R34 4.7k VSS VCCIN 1 2 C24 0.1F R35 100k C46 0.1F R36 4.99k U5 24LC025 R37 4.99k 100 91 93 95 97 99 ENABLE SDA VCCIN
C33 0.1F
R23 51
84 86 88 90
83 85 87 89
VCMB
R33 4.7k
VCC
VDD VCC VCC U8 LT1763 VDD R25 105k C37 10F 6.3V R26 100k C38 0.01F 1 8 IN OUT 2 7 ADJ GND 3 6 GND GND 4 5 BYP SHDN
+
C40 0.1F C48 0.1F C41 0.1F C47 0.1F
E3 VDD 3V
C45 100F 6.3V OPT
C36 4.7F
E5 PWR GND
VCC 11 A7 B7 12 A6 B6 13 B5 A5 14 A4 B4 15 U11 B3 A3 16 A2 B2 17 A1 B1 18 B0 A0
*VERSION TABLE T1, T2 ETC1-1T ETC1-1-13 INPUT FREQUENCY fIN < 70MHz fIN > 70MHz
SCL 1 A0 2 A1 3 A2 4 A3 8 VCC 7 WP 6 SCL 5 SDA R38 4.99k SDA
2299 AI01
ASSEMBLY TYPE DC851A-A DC851A-F
U1 LTC2299IUP LTC2299IUP
R5, R9, R18, R24 24.9 12.4
C6, C31 12pF 8pF
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LTC2299
R10 1k
C15 0.1F
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C7 0.1F
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VCMA
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3
VCM
4
19
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LTC2299
APPLICATIO S I FOR ATIO
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Silkscreen Top Top Side
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LTC2299
APPLICATIO S I FOR ATIO
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Inner Layer 2 GND Inner Layer 3 Power
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LTC2299
APPLICATIO S I FOR ATIO
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Bottom Side
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LTC2299
PACKAGE DESCRIPTIO
0.25 0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 0.75 0.05 R = 0.115 TYP
9 .00 0.10 (4 SIDES)
PIN 1 TOP MARK (SEE NOTE 5)
0.00 - 0.05 NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5 2. ALL DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT 4. EXPOSED PAD SHALL BE SOLDER PLATED 5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 6. DRAWING NOT TO SCALE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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UP Package 64-Lead Plastic QFN (9mm x 9mm)
(Reference LTC DWG # 05-08-1705)
0.70 0.05 7.15 0.05 8.10 0.05 9.50 0.05 (4 SIDES) PACKAGE OUTLINE 63 64 0.40 0.10 1 2 PIN 1 CHAMFER 7.15 0.10 (4-SIDES)
(UP64) QFN 1003
0.200 REF
0.25 0.05 0.50 BSC BOTTOM VIEW--EXPOSED PAD
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LTC2299
RELATED PARTS
PART NUMBER LTC2220 LTC2221 LTC2222 LTC2223 LTC2224 LTC2225 LTC2226 LTC2227 LTC2228 LTC2230 LTC2231 LTC2232 LTC2233 LTC2245 LTC2246 LTC2247 LTC2248 LTC2249 LTC2286 LTC2287 LTC2288 LTC2289 LTC2290 LTC2291 LTC2292 LTC2293 LTC2294 LTC2295 LTC2296 LTC2297 LTC2298 DESCRIPTION 12-Bit, 170Msps ADC 12-Bit, 135Msps ADC 12-Bit, 105Msps ADC 12-Bit, 80Msps ADC 12-Bit, 135Msps ADC 12-Bit, 10Msps ADC 12-Bit, 25Msps ADC 12-Bit, 40Msps ADC 12-Bit, 65Msps ADC 10-Bit, 170Msps ADC 10-Bit, 135Msps ADC 10-Bit, 105Msps ADC 10-Bit, 80Msps ADC 14-Bit, 10Msps ADC 14-Bit, 25Msps ADC 14-Bit, 40Msps ADC 14-Bit, 65Msps ADC 14-Bit, 80Msps ADC 10-Bit, Dual, 25Msps ADC 10-Bit, Dual, 40Msps ADC 10-Bit, Dual, 65Msps ADC 10-Bit, Dual, 80Msps ADC 12-Bit, Dual, 10Msps ADC 12-Bit, Dual, 25Msps ADC 12-Bit, Dual, 40Msps ADC 12-Bit, Dual, 65Msps ADC 12-Bit, Dual, 80Msps ADC 14-Bit, Dual, 10Msps ADC 14-Bit, Dual, 25Msps ADC 14-Bit, Dual, 40Msps ADC 14-Bit, Dual, 65Msps ADC COMMENTS 890mW, 67.5dB SNR, 9mm x 9mm QFN Package 630mW, 67.5dB SNR, 9mm x 9mm QFN Package 475mW, 67.9dB SNR, 7mm x 7mm QFN Package 366mW, 68dB SNR, 7mm x 7mm QFN Package 630mW, 67.5dB SNR, 7mm x 7mm QFN Package 60mW, 71.4dB SNR, 5mm x 5mm QFN Package 75mW, 71.4dB SNR, 5mm x 5mm QFN Package 120mW, 71.4dB SNR, 5mm x 5mm QFN Package 205mW, 71.3dB SNR, 5mm x 5mm QFN Package 890mW, 67.5dB SNR, 9mm x 9mm QFN Package 630mW, 67.5dB SNR, 9mm x 9mm QFN Package 475mW, 61.3dB SNR, 7mm x 7mm QFN Package 366mW, 61.3dB SNR, 7mm x 7mm QFN Package 60mW, 74.4dB SNR, 5mm x 5mm QFN Package 75mW, 74.5dB SNR, 5mm x 5mm QFN Package 120mW, 74.4dB SNR, 5mm x 5mm QFN Package 205mW, 74.3dB SNR, 5mm x 5mm QFN Package 222mW, 73dB SNR, 5mm x 5mm QFN Package 150mW, 61.8dB SNR, 9mm x 9mm QFN Package 235mW, 61.8dB SNR, 9mm x 9mm QFN Package 400mW, 61.8dB SNR, 9mm x 9mm QFN Package 445mW, 61dB SNR, 9mm x 9mm QFN Package 120mW, 71.3dB SNR, 9mm x 9mm QFN Package 150mW, 74.5dB SNR, 9mm x 9mm QFN Package 235mW, 74.4dB SNR, 9mm x 9mm QFN Package 400mW, 74.3dB SNR, 9mm x 9mm QFN Package 422mW, 70.6dB SNR, 9mm x 9mm QFN Package 120mW, 74.4dB SNR, 9mm x 9mm QFN Package 150mW, 74.5dB SNR, 9mm x 9mm QFN Package 235mW, 74.4dB SNR, 9mm x 9mm QFN Package 400mW, 74.3dB SNR, 9mm x 9mm QFN Package
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Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507
LT/TP 0205 1K * PRINTED IN USA
www.linear.com
(c) LINEAR TECHNOLOGY CORPORATION 2005

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